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PDF: 1999 Apr 16 Philips Semiconductors Package outline VSO40: plastic very small outline package; 40 leads SOT158-1 D E A X c y HE vMA Z 40 21 Q A2 A1 pin 1 index Lp L 1 e bp 20 wM detail X (A 3) A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.70 0.11 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 bp 0.42 0.30 c 0.22 0.14 D (1) 15.6 15.2 E (2) 7.6 7.5 0.30 0.29 e 0.762 0.03 HE 12.3 11.8 0.48 0.46 L 2.25 Lp 1.7 1.5 Q 1.15 1.05 v 0.2 w 0.1 y 0.1 Z (1) 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.067 0.089 0.059 0.045 0.024 0.008 0.004 0.004 0.041 0.012 7o 0o Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT158-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-24 |
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